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ossila材料BSB

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产品名称: ossila材料BSB
产品型号: 18826-13-6
产品展商: Ossila
产品文档:
 MSDS BSB

简单介绍


ossila材料BSB  的详细介绍

BSB, 4,4'-di(triphenylsilyl)-biphenyl, has a structure of two triphenyllsilanes joined by a biphenyl spacer. The other family member, UGH-2, has a phenyl spacer.

Having a deep HOMO energy level and a wide bandgap, BSB is normally used as phosphorescent host for blue light-emitting materials such as FIrPic. When compared to UGH-2, it has higher glass transition temperature (Tg = 100 °C) to afford better morphology of OLED device films for higher device performance and stability. Electroluminescence devices using FIrpic as the blue phosphorescence dopant and UGH2, BSB, and BST (4,4″-bis(triphenylsilanyl)-(1,1′,4′,1″)-terphenyl) as the hosts show that BSB provides best device performance.

General Information


CAS number 18826-13-6
Chemical formula C48H38Si2
Molecular weight 670.99 g/mol
Absorption λmax 271 nm (dichloromethane)
Photoluminescence λem 432 nm (dichloromethane)
HOMO/LUMO HOMO = 6.5 eV, LUMO = 2.3 eV; ET = 2.76 eV [1]
Chemical name 4,4'-Di(triphenylsilyl)-biphenyl
Synonyms 4,4'-bis-triphenylsilanyl-biphenyl, 4,4'-di(triphenylsilyl)-biphenyl
Classification / Family Arylsilane derivatives, Phosphorescent host materials, Electron transport materials, Hole blocking layer materials, Sublimed materials, Semiconducting small molecules

Product Details


Purity Sublimed >99.0% (HPLC)
Melting point Tg = 100 °C (lit.)
Appearance White powder/crystals
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