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详情介绍:

Experimental

OFET device specifications

This table shows details of the substrates used in this fabrication routine.

Substrates Ossila silicon/silicon dioxide substrates (S146)
Substrate size 20 x 15 mm
Gate conductivity 1-30 Ω·cm (Boron doped)
Silicon oxide thickness 300 nm
Device per substrates Five, common gate
Channel length 30 µm
Channel width 1000 µm
OFET architecture Top contact, bottom gate
Source-Drain patterning Thermal evaporation using Source-Drain Deposition Mask for Low Density OFETs


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