Handheld tools for cutting and cleaving glass, silicon, and hard materials. Carbide wheels produce fewer particles when scribing, when compared to diamond pointed scribes. Both large and small CleanBreak™ pliers are included for handling larger and thicker samples. The cutters included are: Standard cutter for general purposes cutting of glass, silicon, and other crystalline materials. Also suitable for thin glass 0.3-1.5 mm and hard glass 0.3-6mm thick; Laser cutter, allowing higher surface penetration and non-slip start. It is used for glass 0.1-2 mm think, hard glass 0.3-2 mm thick, and quartz, silicon, and III-V substrates; Cutter for ultra-thin glass 0.03-2mm and hard glass 0.3-2mm. It also excels at cutting thin quartz and III-V substrates.